Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process

Hwang, Hee-Sub; Lim, Jae-Hyung; Park, Jin-Hyung; Choi, Eun‐Suck; Ahn, Jin-Woo; Park, Jea‐Gun

doi:10.1149/1.3314249

Public

Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process

Published in Electrochemical and Solid-State Letters • Jan 1, 2010

Authors:

Hee-Sub Hwang

Jae-Hyung Lim

Jin-Hyung Park

Abstract

Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process, Hwang, Hee-Sub, Lim, Jae-Hyung, Park, Jin-Hyung, Choi, Eun-Suck, Ahn, Jin-Woo, Park, Jea-Gun

Subject

Passivation

Wafer

Materials science

Finding related papers...

Discussions

(0)

No comments yet

Be the first to share your thoughts!