Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

This paper introduces the first comprehensive and accurate compact resistance-inductance-capacitance-conductance (RLCG) model for through-silicon vias (TSVs) in 3-D ICs valid from low- to high-frequency regimes, with consideration of the MOS effect in silicon, the alternating-current (ac) conduction... View More