Electrografted P4VP for High Aspect Ratio Copper TSV Insulation in Via-Last Process Flow

Public

Published in ECS Journal of Solid State Science and Technology • Jan 1, 2016

Authors:

T Dequivre

Elias Al Alam

Josée Maurais

Abstract

International audience

Research Assistant

AI chat, annotations, notes & similar papers

Finding related papers...

(0)

No comments yet

Be the first to share your thoughts!