The role of amine ligands in governing film morphology and electrical properties of copper films derived from copper formate-based molecular inks

Paquet, Chantal; Lacelle, Thomas; Liu, Xiangyang; Deore, Bhavana; J. Kell, Arnold; Lafrenière, Sylvie; R. L. Malenfant, Patrick

doi:10.1039/c7nr08891d

Public

The role of amine ligands in governing film morphology and electrical properties of copper films derived from copper formate-based molecular inks

Shared by NobleBlocks on Jan 1, 2018 • 12:00 AM UTC

Authors:

Chantal Paquet

Thomas Lacelle

Xiangyang Liu

Abstract

The release profile of ligands from copper formate complexes during thermal decomposition influences the morphology and electrical properties of their films.

Discussions