Nanoporous Copper–Silver Alloys by Additive-Controlled Electrodeposition for the Selective Electroreduction of CO<sub>2</sub> to Ethylene and Ethanol

Thi Huong Hoang, Thao; Verma, Sumit; Ma, Sichao; T. Fister, T.; Timoshenko, Janis; I. Frenkel, Anatoly; J. A. Kenis, Paul; A. Gewirth, Andrew

doi:10.1021/jacs.8b01868

Public

Nanoporous Copper–Silver Alloys by Additive-Controlled Electrodeposition for the Selective Electroreduction of CO2 to Ethylene and Ethanol

Published in Journal of the American Chemical Society • Apr 5, 2018

Authors:

Thao Thi Huong Hoang

Sumit Verma

Sichao Ma

Abstract

Electrodeposition of CuAg alloy films from plating baths containing 3,5-diamino-1,2,4-triazole (DAT) as an inhibitor yields high surface area catalysts for the active and selective electroreduction of CO2 to multicarbon hydrocarbons and oxygenates. EXAFS shows the co-deposited alloy film to be homog...

Subject

Chemistry

Nanoporous

Copper

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