Dicing of gallium arsenide (GaAs) wafers with the laser MicroJet® challenges, improvements and safety issues

GaAs wafers are fragile and brittle and, therefore, the well-developed dicing saw technique, which is widely used in the silicon industry, faces serious problems when used for dicing GaAs wafers. GaAs wafers are very sensitive to changes in the dicing tools and to drifts in the dicing machinery, whi... View More