Experimental study on the thermal response of PCM-based heat sink using structured porous material fabricated by 3D printing

Hu, Xusheng; Gong, Xiaolu

doi:10.1016/j.csite.2021.100844

Public

Experimental study on the thermal response of PCM-based heat sink using structured porous material fabricated by 3D printing

Published in Case Studies in Thermal Engineering • Jan 10, 2021

Authors:

Xusheng Hu

Xiaolu Gong

Abstract

Phase change material (PCM) based heat sink has the potential to be applied for the thermal management of electronic devices. Whereas, PCM suffers from a low thermal conductivity, which results in local overheating at the base of heat sink. To enhance thermal performance of heat sink, a structured p...

Subject

Heat sink

Materials science

Overheating (electricity)

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